Enfis design and manufactures smart LED light engines for custom OEM applications. Our smart LED light engine team includes LED chip design and packaging experts. Our capabilities include thermal and optical simulation tools and advanced LED test and measurement methods, including reliability testing.

When designing smart LED light engine solutions for our OEM customers, Enfis approaches the problem not constrained by production method or packaging methodology. Enfis considers the solution on a customised case-by-case basis, utilising in-house facilities as well as partner out-source facilities to provide the most suitable, cost-effective solution for the application.

These LED design and packaging facilities include...

• Finite Element Thermal Analysis
• Non-sequential ray tracing
• On-site pick and place bonder
• On-site wire bonder
• Varity of encapsulation methods depending on wavelength and specification
• Flip-chip ball grid array packaging
• Enfis' proprietary STA-Class (densely packed flat tileable array) Module
• Multi-chip, multi-colour high density LED array
• Multi-chip devices on standard headers
• Distributed multi-chip-on-board LEDs for low cost large area illumination

Enfis has a wide knowledge and experience concerning LEDs at wavelength from UV-B (280nm) through visible and into IR wavelength. As such, any wavelength in this range is within Enfis' capabilities.

The consideration of price point and performance criteria is used to create a customised solution to meet our customer' s needs.

In many cases, a prototype solution is designed and manufactured quickly in conjunction with design suitability for volume manufacture.