High Power LED systems are emerging as key illumination devices. The electrical-optic efficiency of LEDs are at best 30% which means that more than 70% of the electrical power is not used to produce light.

This excess power becomes heat stored in the LED chip which provides performance and reliability issues unless the heat is conducted away from the chip effectively. Efficient thermal management technology and methods are the key to providing these heat conduction pathways. The major limitation to the power emitted by LEDs is the thermal limitation effects.

Enfis has devoted many man years of development resource to the optimisation of its thermal management processes. As such, we have been able to deliver very high power densities from high performance LED arrays and light engines only when combined with our thermal management know-how some of which is currently in the patenting process.

Creating High Power Density Packaging creates large amounts of heat. Heat removal and even cooling below ambient is key to efficient and reliable LED operation
Focus on novel and cost effective heat management techniques to suit requirements

Our thermal management techniques include...

• Finite element thermal analysis
• Peltier Cooling
• Water Cooling
• Forced Air Cooling
• Fluidic Heat exchangers
• Phase Change Materials
• Heat Pipes
• Evaporative Cooling

Combinations of above techniques depending on requirements. Systems designed to provide lower cost solutions